ASML locks in TSMC, Samsung, Intel on High-NA EUV lithography
asml wins commitments from tsmc, samsung, and intel for high-na euv lithography machines, a critical bottleneck in building advanced ai chips. this deal solidifies asml's grip on the market.
asml, the world's only maker of euv lithography machines, has won commitments from leading chipmakers tsmc, samsung, and intel to adopt its high-na euv lithography technology. tsmc plans to start using the machines in 2030, samsung in 2028, and intel already has the machines in operation. the deal involves a shift to larger 12-inch photomasks, which could increase the throughput of high-na machines by 40%. this development is critical for the production of advanced ai chips. huawei is meanwhile trying to break china's dependence on asml's technology.